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Ships within 48 hours · Estimated delivery Aug 8 - Aug 13
Temperature Control 5~30 °C
Currently configured with 4" wafer chuck
no additional cables or parts
These recipes are created by the Process Engineer to monitor and control the parameters of the processing cycle
Water cooled refrigeration system requires water cooling of refrigeration compressor
Used MPI LEDA-8F 3G Plus-V 110 Brand:Bid Service Temperature Control 5~30 °CMPI LEDA 8F 3G Plus V 110 3G Wafer Prober. Plus V is a wafer prober for testing diced die on stretch frame (dies on blue tape mounted on a tape ring). Wafers cut, broken by scribing, laser etc. and then expanded on stretch frame. May be tested to determine if any secondary operations have damaged the product. The maximum test area for the system is 6 inches of active die area or smaller. Machine Features: 3G Plus V provides the functions of die
US$ 14.00
US$ 125.00
US$ 456.94
